COMP Associate Professor Dr Dan Wang won TechConnect 2017 Innovation Award
We are pleased to announce that Dr Dan Wang, Associate Professor of COMP, won the TechConnect 2017 Innovation Award with his project “A Scalable Personalized Thermal-Comfort Platform for Building Energy Conservation”. The award will be presented at TechConnect National Innovation Summit held in Washington, D.C. on 14 - 17 May 2017.
This year, there are total 87 awards among more than 500 submitted technologies and PolyU has received 3 of them.
The TechConnect Innovation Awards identify the top 15% of submitted technologies as ranked by the TechConnect Corporate & Investment Partner Committee. Innovation rankings are based on the potential positive impact the submitted technology will have on a specific industry sector.